Table 1: Design Parameters for Simulation double gate TFET.

Parameters

Nomenclature

Numerical value

fM

Work function (eV)

5.2

NS

Doping levels for source (cm-3)

1.1 × 020

ND

Doping level for Drain (cm-3)

5.1 × 018

NC

Doping level for channel (cm-3)

1015

tox

Gate oxide material thickness (nm)

2.0

Lt

Total length of the device (nm)

250.0

Lch

Channel length (nm)

50.0

tSi

Silicon film thickness (nm)

10.0

LS/LD

Source and drain lengths (nm)

100.0